Wafer Ring
Comparison of Mount Ring Materials
| Items | Existing | New One | Remark |
|---|---|---|---|
| Raw Material | SUS304SS | Al 5052 | |
| Material Composition | 18Cr-8Ni | Al 2.2%, Mg 0.4%, Fe 0.25%, Si | |
| Surface Coating Material | N/A | T-Coating(Al2O3-AlN-BN) | |
| Surface Coating Thickness | N/A | 25㎛ | |
| Hardness | 200Hv | 50Hv | |
| Yield Strength | 20.5kgf/㎟ | 9.1kgf/㎟ | |
| Elongation | 35% | 25% | |
| Corrosion Resisting | Yes | Yes | |
| Non-Magnetic Material | Yes | Yes | |
| Abrasion Resistance of Taping Cutter | Easy Cutter Wearing | Longer Cutter Life-time | |
| Weight (Base on 8-inch wafer, 1.2mmt) |
158g | 54g | 65% Drop |
| Flatness | less 1.0㎜ | less 1.0㎜ | |
| Taping Adhesion Strength - (g/25㎜) (Base on V-8-S Tape) |
100g | 100g (by Same-Level Smooth) | Confirms to JIS Z0237 |
| Recycle | Yes | Yes | by IPS Cleaning and Flatness Spec |
