TIM from HALA
- Gap Filter
thermally conductive - Silicone Foils / Caps
thermally conductive
- Interface Materials
thermally conductive / electrically non-insulating - Insulating Interface Materials
thermally conductive
Pre-Applied Pahse Change Compound Applications
- Power Modules
- IMS
- Semiconductor Packages
- Micro and Signal Processors
- LED Substrates
- Memory Modules
- Relais
- TECs
- NanoSpreader™ and Heat Pipes
- etc.
Pre-Applied Pahse Change Compound Application
HALA THERMAL INTERFACE SOLUTIONS
Phase Change
Films
- TPC-Z-PC
- TPC-T-AL-CB
- TPC-S-AL
Printable
- TPC-Z-PC-P
- TPC-X-PC-NC
Dispensable
- TPC-Z-PC-D
Graphite foil
- TFO-S-CB
Silicone foil
- TEL-Z-SI
Please contact us as your development partner.