TIM from HALA

  • Gap Filter
    thermally conductive
  • Silicone Foils / Caps
    thermally conductive
  • Interface Materials
    thermally conductive / electrically non-insulating
  • Insulating Interface Materials
    thermally conductive

Pre-Applied Pahse Change Compound Applications

  • Power Modules
  • IMS
  • Semiconductor Packages
  • Micro and Signal Processors
  • LED Substrates
  • Memory Modules
  • Relais
  • TECs
  • NanoSpreader™ and Heat Pipes
  • etc.

Pre-Applied Pahse Change Compound Application

HALA THERMAL INTERFACE SOLUTIONS
Phase Change
Films
  • TPC-Z-PC
  • TPC-T-AL-CB
  • TPC-S-AL
Printable
  • TPC-Z-PC-P
  • TPC-X-PC-NC
Dispensable
  • TPC-Z-PC-D
Graphite foil
  • TFO-S-CB
Silicone foil
  • TEL-Z-SI

Please contact us as your development partner.